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Inspect and Backup
Dual Channel Portable Digital Ultrasonic Flaw Detector And Recorder
- Large Bright High Resolution Color Touch Screen
- Built-In Encoder Interface
- USB, LAN, VGA outputs
- Huge Data Storage Capability
- Longitudinal, Shear, Guided, and Surface Waves
- A-, B-, CB-, C-, D-, P-Scan and TOFD
- Corrosion Profiling and Flaw Imaging
- Up To 20m Length of One Line Scanning Record
- Playback A-Scans for Recorded Images
- Enhanced Signal Evaluation for Live and Frozen A-Scans
- Defect Sizing and Pattern Analysis
- Compliance with ASME and RBIM Procedures
ISONIC 2007 uniquely combines functionality and mobility of high performance portable digital single or dual channel ultrasonic flaw detector with recording, imaging,
and data processing capabilities of smart computerized dual channel inspection system
ISONIC 2007 resolves a variety of ultrasonic inspection tasks:
- A-Scan-based inspection using conventional pulse echo, back echo attenuation, and through transmission techniques
- Single Channel Straight Line Scanning and Recording:
- Thickness Profile B-Scan imaging and recording is performed through continuous capturing of wall thickness readings along probe trace
- B-Scan cross-sectional imaging and recording of defects for longitudinal and shear wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace
- CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace
- TOFD Inspection RF B-Scan and D-Scan Imaging
For Single Channel Straight Line Scanning and Recording it may be used:
- Time-based mode (built-in real time clock)
- True-to-location mode (built-in incremental encoder interface)
- Dual Channel Straight Line Scanning and Recording:
- Thickness Profile B-Scan imaging and recording is performed through continuous capturing of wall thickness readings along probe trace
- CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace
- TOFD Inspection RF B-Scan and D-Scan Imaging
For Dual Channel Straight Line Scanning and Recording it may be used:
- True-to-location mode (built-in incremental encoder interface)
- XY-Scanning and Recording with C-Scan and B-Scan imaging is also possible if using optional USB interface to multi-axis mechanical encoder and appropriate software package
For all types of Straight Line Scanning and XY-Scanning records A-Scans are captured for each probe position along probe trace and may be played back and evaluated off-line at postprocessing stage. This unique feature makes it possible off-line defect characterization through echo-dynamic pattern analysis
Thickness Profile B-Scan Data recorded during Straight Line Scanning is presented in the format compatible with various Risk Based Inspection and Maintenance procedures
ISONIC 2007 has practically unlimited capacity for storing of:
- Single A-Scans accompanied with corresponding instrument settings
- Ultrasonic signal spectrum graphs (FFT) accompanied with corresponding RF A-Scans and instrument settings
- Various A-Scans sequence records along with corresponding Thickness Profiles, B-Scans, CB-Scans or TOFD Maps depending on mode of operation selected; each record is accompanied with corresponding instrument settings
ISONIC 2007 complies with requirements of National and International Codes:
- ASME Section I Rules for Construction of Power Boilers
- ASME Section VIII, Division 1 Rules for Construction of Pressure Vessels
- ASME Section VIII, Division 2 Rules for Construction of Pressure Vessels. Alternative Rules
- ASME Section VIII Article KE-3 Examination of Welds and Acceptance Criteria
- ASME Code Case 2235 Rev 9 Use of Ultrasonic Examination in Lieu of Radiography
- Non-Destructive Examination of Welded Joints Ultrasonic Examination of Welded Joints. British and European Standard BS EN 1714:1998
- Non-Destructive Examination of Welds Ultrasonic Examination Characterization of Indications in Welds. British and European Standard BS EN 1713:1998
- Calibration and Setting-Up of the Ultrasonic Time of Flight Diffraction (TOFD) Technique for the Detection, Location and Sizing of Flaws. British Standard BS 7706:1993
- WI 00121377, Welding Use Of Time-Of-Flight Diffraction Technique (TOFD) For Testing Of Welds. European Committee for Standardization Document # CEN/TC 121/SC 5/WG 2 N 146, issued Feb, 12, 2003
- Non-Destructive Testing Ultrasonic Examination Part 5: Characterization and Sizing of Discontinuities. British and European Standard BS EN 583-5:2001
- Non-Destructive Testing Ultrasonic Examination Part 2: Sensitivity and Range Setting. British and European Standard BS EN 583-2:2001
- Manufacture and Testing of Pressure Vessels. Non-Destructive Testing of Welded Joints. Minimum Requirement for Non-Destructive Testing Methods Appendix 1 to AD-Merkblatt HP5/3 (Germany). Edition July 1989
Download High Resolution PDF Brochure
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Technical Data
| Pulse Type*: |
Positive Spike Pulse / Positive Square Wave Pulse |
| Initial Transition*: |
≤5 ns (10-90%) |
| Pulse Amplitude*: |
Spike pulse - smoothly tunable (18 levels) 50V
400 V into 50 Ω at 4 levels of excitation energy
Square wave pulse - smoothly tunable (18 levels) 50V
400 V into 50 Ω |
| Pulse Duration*: |
Spike pulse - 10
70 ns for 50 Ω load depending on Energy and Damping setup
Square wave pulse - 65
600 ns controllable in 5 ns step with driving of both leading edge and trailing edge of the pulse |
| Energy (Spike Pulse)*: |
4 discrete energy values / 40 μJ (min) to 250 μJ (max) at 400V amplitude |
| Modes*: |
Single / Dual |
| Damping*: |
17 discrete resistances values / 25Ω min to 1000 Ω max |
| Internal Matching Coil Probe Impedance Matching*: |
16 discrete inductivity values / 2 μH min to 78 μH max |
| PRF*: |
0 optionally; 15...5000 Hz controllable in 1 Hz resolution |
| Optional Sync Output / Input*: |
Max +5V, τ ≤ 5 ns, t ≥100 ns, Load Impedance ≥50 Ω |
| Gain*: |
0...120 dB controllable in 0.5 dB resolution |
| Advanced Low Noise Design*: |
93 μV peak to peak input referred to 80 dB gain / 35 MHz bandwidth |
| Frequency Band*: |
0.35...35 MHz Wide Band / 34 Sub Bands |
| Ultrasound Velocity*: |
300...20000 m/s (11.81
787.4 "/ms) controllable in 1 m/s (0.1 "/ms) resolution |
| Range*: |
0.5...3000 μs - controllable in 0.01 μs resolution |
| Display Delay*: |
0...3200 μs - controllable in 0.01 μs resolution |
| Probe Angle*: |
0
90° controllable in 1° resolution |
| Probe Delay*: |
0 to 70 μs controllable in 0.01μs resolution - expandable |
| Display Modes* |
RF, Rectified (Full Wave / Negative or Positive Half Wave), Signal's Spectrum (FFT) |
| Reject*: |
0...99 % of screen height controllable in 1% resolution |
| DAC / TCG*: |
Theoretical through keying in dB/mm (dB/") factor
Experimental through sequential recording echo amplitudes from variously located equal reflectors
46 dB Dynamic Range, Slope ≤ 20 dB/μs, Capacity ≤40 points
Available for Rectified and RF Display
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| DGS*: |
Standard Library for 18 probes / unlimitedly expandable |
| Gates*: |
2 Independent Gates / unlimitedly expandable |
| Gate Start and Width*: |
Controllable over whole variety of A-Scan Display Delay and A-Scan Range settings
in 0.1 mm /// 0.001" resolution |
| Gate Threshold*: |
5
95 % of A-Scan height controllable in 1 % resolution |
Measuring Functions Digital
Display Readout*: |
27 automatic functions / expandable; Dual Ultrasound Velocity Measurement Mode for
Multi-Layer Structures; Curved Surface / Thickness / Skip correction for angle beam probes; Ultrasound velocity and Probe Delay Auto-Calibration for all types of probes
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Freeze (A-Scans and Spectrum Graphs)* |
- Freeze All
- Freeze Peak
- All signal and spectrum evaluation functions, managing gates and Gain settings are allowed for frozen signals
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| Encoder Interface: |
Built-in interface for incremental mechanical encoder |
| Imaging Modes: |
Thickness Profile B-Scan, Cross-sectional B-Scan, Plane View CB-Scan, TOFD |
| Encoding: |
Time-based or True-to-location (incremental encoder) |
| Length of one record: |
50
20000 mm (2"
800"), automatic scrolling |
| Method of Record**: |
Complete raw data recording |
| Region of Interest**: |
Controllable over entire Display Delay, Probe Delay, Range, US Velocity and other appropriate
instrument settings |
| Off-Line Image Analysis**: |
- Recovery and play back of A-Scan captured during scanning
- Echo-dynamic pattern analysis ท Defects sizing and outlining
- Statistical analysis of Thickness / Amplitude data
- Converting Record into ASCII/MS Excel®/MS Wordา formats
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| Data Reporting**: |
Direct printout of Calibration Dumps, A-Scans, Spectrum Graphs, thickness profile B-Scans,
cross-sectional B-Scans, plane view CB-Scans, TOFD maps |
| Data Storage Capacity: |
At least 100000 sets including calibration dumps accompanied with A-Scans and/or Spectrum
Graphs; At least 10000 sets including calibration dumps accompanied with thickness profile
B-Scans or cross-sectional B-Scans or plane view CB-Scans or TOFD maps |
| On-Board Computer |
AMD LX 800 - 500MHz |
| RAM: |
512 Megabytes |
| Flash Memory - Quasi HDD |
4 Gigabytes |
| Outputs: |
LAN, USB X 2, PS 2, SVGA |
| Screen: |
6.5" High Color Resolution (32 bit) SVGA 640×480 pixels 133×98 mm (5.24" ×3.86") Sun-readable
LCD; Maximal A-Scan Size (working area) 130×92 mm (5.12" × 3.62") |
| Controls: |
Front Panel Sealed Keyboard, Front Panel Sealed Mouse, Touch Screen |
| Compatibility with the external devices: |
PS 2 Keyboard and Mouse, USB Keyboard and Mouse, USB Flash Memory card, Printer
through USB or LAN, PC through USB or LAN, SVGA External Monitor |
| Operating System: |
Windows™ XP Embedded |
| Power: |
Mains - 100
240 VAC, 40
70 Hz, auto-switch; Battery 12V 8AH up to 6 hours continuous operation |
| Housing: |
IP 53 rugged aluminum case with carrying handle |
| Dimensions: |
265×156×101 mm (10.43"×6.14"×3.98") - without battery
265×156×139 mm (10.43"×6.14"×5.47") - with battery |
| Weight: |
2.650 kg (5.83 lbs) - without battery
3.580 kg (7.88 lbs) - with battery |
* for both channels
** for single and dual channel operation
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Conventional pulse echo and through transmission A-Scan-based inspection
- 640X480 pixels A-Scan display with physical dimensions 130 x 90 mm (5.12" x 3.62") of working area is largest one for the plurality of portable ultrasonic flaw detectors
- Combined adjustable spike wave / square wave pulser equipped with variety of probe impedance matching coils provides optimal ultrasound penetration for various materials characterized either by high or low grain, sound attenuation, and the like
- High frequency probe may not be destroyed occasionally upon connecting to instrument's firing output even if duration of square wave initial pulse is improperly long thanks to probe damage prevention circuit automatically limiting energy transmitted to probe's crystal
- 46 dB dynamic range 20 dB/ตs maximum slope multiple curve DAC/TCG may be created using up to 40 data points to correct distance amplitude variations of ultrasonic signals
- Both theoretical and experimental DAC may be activated either through keying in dB/mm (dB/") factor or through sequential recording echo amplitudes from variously located equal reflectors
- DAC/TCG may be applied to rectified A-Scans (positive, negative, and full wave) and to RF A-Scans as well
- Built-in DGS data base for standard probes is unlimitedly expandable
- Thanks to extended dynamic range signals significantly exceeding A-Scan height (up to 199.9%) may be evaluated without dropping instrument Gain
- Whilst A-Scan is frozen managing of Gain and Gates settings is still allowed and provides bringing signals to necessary evaluation level and performing required evaluation
- Dual Ultrasound Velocity Measurement Mode extremely simplifies resolving of sound path distances for dissimilar materials adjacent to each other whereas different values of ultrasound velocity are valid for corresponding signals appearing on the same A-Scan
- RF display mode combined with frequency domain signal analysis enhances capabilities of the instrument for materials characterization, bond inspection, testing of dissimilar materials, defect pattern analysis, and probes evaluation
- Optional data logger organizes and manages database files capable to store up to 254745 thickness readings each and organized as 2D matrix. In database every thickness reading is accompanied with corresponding raw data A-Scan and instrument setup. Automatic creating of MS Excel® thickness spreadsheet meets requirements of various Risk Based Inspection and Maintenance (RBIM) procedures
- And more
see technical data page
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Single Channel Thickness Profile imaging and recording is performed through continuous capturing of thickness readings along probe trace:
- Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported
- Complete sequence of A-Scans is recorded along with thickness profile
- Off-line evaluation of thickness profile record is featured with:
- Sizing of thickness damages at any location along stored image: remaining thickness, thickness loss, and length of damage
- Play-back and evaluation of A-Scans obtained during scanning
- Off-line reconstruction of thickness profile image for various Gain and/or Gate settings
- Automatic conversion of thickness profile B-Scan data into MS Excel® thickness spreadsheet meeting requirements of various Risk Based Inspection and Maintenance (RBIM) procedures
Typical Application: Corrosion characterization
For Thickness Profile imaging movie example click here

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On-Line
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Off-Line
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Dual Channel Thickness Profile imaging and recording is performed through continuous capturing of thickness readings along probe trace:
- True-to-location data recording
- Complete sequence of A-Scans is recorded along with thickness profiles
- Off-line evaluation of thickness profile record is featured with:
- Sizing of thickness damages at any location along stored image: remaining thickness, thickness loss, and length of damage
- Play-back and evaluation of A-Scans obtained during scanning
- Off-line reconstruction of thickness profile image for various Gain and/or Gate settings
- Automatic conversion of thickness profile B-Scan data into MS Excel® thickness spreadsheet meeting requirements of various Risk Based Inspection and Maintenance (RBIM) procedures
Typical Application: Corrosion characterization
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On-Line
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Off-Line
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B-Scan cross-sectional imaging and recording of defects for longitudinal and shear wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace:
- Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported
- Complete sequence of A-Scans is recorded along with B-Scan defects images
- Off-line evaluation of B-Scan record is featured with:
- Sizing of defects at any location along stored image coordinates and projection dimensions
- Play-back and evaluation of A-Scans obtained during scanning
- Defects outlining and echo-dynamic pattern
- Reconstruction of B-Scan defects images for the various Gain and/or Reject settings
- DAC / DGS B-Scan normalization
Typical Applications: Pulse echo inspection of welds, composites, metals, plastics, and the like
For B-Scan cross-sectional imaging movie example click here

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On-Line
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Off-Line
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Single Channel CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace:
- Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported
- Complete sequence of A-Scans is recorded along with CB-Scan defects images
- Off-line evaluation of CB-Scan record is featured with:
- Sizing of defects at any location along stored image coordinates and projection dimensions
- Play-back and evaluation of A-Scans obtained during scanning
- Defects outlining and echo-dynamic pattern analysis
- Reconstruction of CB-Scan defects images for various Gain and/or Reject settings
- DAC/DGS CB-Scan normalization
Typical Applications: Long range pulse echo and CHIME inspection of annular plates and pipes, for pitting, stress corrosion, etc; weld inspection, surface wave inspection
For CB-Scan horizontal plane-view imaging movie example click here

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On-Line
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Off-Line
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Dual Channel CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace:
- True-to-location data recording
- Complete sequence of A-Scans is recorded along with CB-Scan defects images for both channels
- Off-line evaluation of CB-Scan records is featured with:
- Sizing of defects at any location along stored images coordinates and projection dimensions
- Play-back and evaluation of A-Scans obtained during scanning
- Defects outlining and echo-dynamic pattern
- Reconstruction of CB-Scan defects images for various Gain and/or Reject settings
- DAC/DGS CB-Scan normalization
Typical Applications: High speed long range pulse echo and CHIME inspection of pipes with partially removed insulation, tank shells, palates for pitting, stress corrosion, etc; weld inspection, surface wave inspection
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Off-Line
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Single Channel TOFD Inspection RF B-Scan and D-Scan Imaging
- Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported
- Averaging A-Scans whilst recording as per operator's selection
- Complete sequence of RF A-Scans is recorded along with TOFD map
- Off-line evaluation of TOFD Map is featured with:
- Improvement of near to surface resolution through removal of lateral wave and/or back echo record
- Linearization and straightening
- Play-back and evaluation of A-Scans obtained during scanning
- Increasing contrast of TOFD images through varying Gain setting and/or rectification
- Defects pattern analysis and sizing
- Zoom of TOFD Map and A-Scans
Typical Applications: weld inspection; CHIME inspection
For TOFD Inspection movie example click here

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On-Line
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Off-Line
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Off-Line
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Dual Channel TOFD Inspection RF B-Scan
- True-to-location data recording
- Averaging A-Scans whilst recording as per operator's selection
- Complete sequence of RF A-Scans is recorded along with TOFD maps for both channels
- Off-line evaluation of TOFD Map is featured with:
- Improvement of near to surface resolution through removal of lateral wave and/or back echo record
- Linearization and straightening
- Play-back and evaluation of A-Scans obtained during scanning
- Increasing contrast of TOFD images through varying Gain setting and/or rectification
- Defects pattern analysis and sizing
- Zoom of TOFD Map and A-Scans
Typical Application: high speed automatic or semi-automatic weld inspection
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Off-Line
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