ISONIC 2006 Return to Sonotron NDT Home Page Inspect and Backup Portable Digital Ultrasonic Flaw Detector And Recorder Large Bright High Resolution Color Touch Screen Built-In Probe Position Encoding Means USB, LAN, VGA outputs Huge Data Storage Capability Longitudinal, Shear, Guided, and Surface Waves A-, B-, CB-, C-, D-, P-Scan and TOFD Corrosion Profiling and Flaw Imaging Up To 20m Length of One Line Scanning Record Playback A-Scans for Recorded Images Enhanced Signal Evaluation for Live and Frozen A-Scans Defect Sizing and Pattern Analysis Compliance with ASME and RBIM Procedures ISONIC 2006 uniquely combines functionality and mobility of high performance portable digital ultrasonic flaw detector with recording, imaging, and data processing capabilities of smart computerized inspection system ISONIC 2006 resolves a variety of ultrasonic inspection tasks: A-Scan-based inspection using conventional pulse echo, back echo attenuation, and through transmission techniques Straight Line Scanning and Recording: Thickness Profile B-Scan imaging and recording is performed through continuous capturing of wall thickness readings along probe trace B-Scan cross-sectional imaging and recording of defects for longitudinal and shear wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace TOFD Inspection – RF B-Scan and D-Scan Imaging For Straight Line Scanning and Recording it may be used: Time-based mode (built-in real time clock) True-to-location mode (built-in incremental encoder interface) XY-Scanning and Recording: Corrosion (thickness) mapping is performed through continuous capturing of wall thickness readings along probe trace Flaw Detection – Pulse Echo 3D imaging (C-Scan, B-Scan, D-Scan, P-Scan) and recording of defects for longitudinal and shear wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace with probe swiveling angle dependency where applicable Flaw Detection – Through Transmission / Back Echo Attenuation 2D imaging and recording (C-Scan) is performed through continuous measuring of signal amplitudes along probe trace CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace For XY-Scanning records ISONIC 2006 is equipped with built-in airborne ultrasound encoder controller and appropriate interface. TOFD Inspection may be also implemented using this type of encoder. Optional USB interface to multi-axis mechanical encoder and appropriate software package are also available For all types of Straight Line Scanning and XY-Scanning records A-Scans are captured for each probe position along probe trace and may be played back and evaluated off-line at postprocessing stage. This unique feature makes it possible off-line defect characterization through echo-dynamic pattern analysis Thickness Profile B-Scan Data recorded during Straight Line Scanning and Corrosion (thickness) Map data recorded during XY-Scanning is presented in the format compatible with various Risk Based Inspection and Maintenance procedures ISONIC 2006 is a new generation successor of very well known ISONIC 2001 model, which became World leading multitask portable ultrasonic testing and imaging equipment during recent years (2000 though 2006) and received Frost & Sullivan Award for Product Differentiation Innovation in 2004. Comparing to its predecessor ISONIC 2006 has significantly improved portability and weight, battery life, ultrasonic performance, data processing speed, and human interface ISONIC 2006 has practically unlimited capacity for storing of: Single A-Scans accompanied with corresponding instrument settings Ultrasonic signal spectrum graphs (FFT) accompanied with corresponding RF A-Scans and instrument settings Various A-Scans sequence records along with corresponding Thickness Profiles, B-Scans, CB-Scans, C-Scans, D-Scans, P-Scans, or TOFD Maps depending on mode of operation selected; each record is accompanied with corresponding instrument settings ISONIC 2006 complies with requirements of National and International Codes: ASME Section I – Rules for Construction of Power Boilers ASME Section VIII, Division 1 – Rules for Construction of Pressure Vessels ASME Section VIII, Division 2 – Rules for Construction of Pressure Vessels. Alternative Rules ASME Section VIII Article KE-3 – Examination of Welds and Acceptance Criteria ASME Code Case 2235 Rev 9 – Use of Ultrasonic Examination in Lieu of Radiography Non-Destructive Examination of Welded Joints – Ultrasonic Examination of Welded Joints. – British and European Standard BS EN 1714:1998 Non-Destructive Examination of Welds – Ultrasonic Examination – Characterization of Indications in Welds. – British and European Standard BS EN 1713:1998 Calibration and Setting-Up of the Ultrasonic Time of Flight Diffraction (TOFD) Technique for the Detection, Location and Sizing of Flaws. – British Standard BS 7706:1993 WI 00121377, Welding – Use Of Time-Of-Flight Diffraction Technique (TOFD) For Testing Of Welds. – European Committee for Standardization – Document # CEN/TC 121/SC 5/WG 2 N 146, issued Feb, 12, 2003 Non-Destructive Testing – Ultrasonic Examination – Part 5: Characterization and Sizing of Discontinuities. – British and European Standard BS EN 583-5:2001 Non-Destructive Testing – Ultrasonic Examination – Part 2: Sensitivity and Range Setting. – British and European Standard BS EN 583-2:2001 Manufacture and Testing of Pressure Vessels. Non-Destructive Testing of Welded Joints. Minimum Requirement for Non-Destructive Testing Methods – Appendix 1 to AD-Merkblatt HP5/3 (Germany).– Edition July 1989 Download High Resolution PDF Brochure Technical Data Pulse Type: Positive Spike Pulse / Positive Square Wave Pulse Initial Transition: ≤5 ns (10-90%) Pulse Amplitude: Spike pulse - smoothly tunable (18 levels) 50V 400 V into 50 Ω at 4 levels of excitation energy Square wave pulse - smoothly tunable (18 levels) 50V 400 V into 50 Ω Pulse Duration: Spike pulse - 10 70 ns for 50 Ω load depending on Energy and Damping setup Square wave pulse - 65 600 ns controllable in 5 ns step with driving of both leading edge and trailing edge of the pulse Energy (Spike Pulse): 4 discrete energy values / 40 μJ (min) to 250 μJ (max) – at 400V amplitude Modes: Single / Dual Damping: 17 discrete resistances values / 25Ω min to 1000 Ω max Internal Matching Coil – Probe Impedance Matching: 16 discrete inductivity values / 2 μH min to 78 μH max PRF: 0 – optionally; 15...5000 Hz controllable in 1 Hz resolution Optional Sync Output / Input: Max +5V, τ ≤ 5 ns, t ≥100 ns, Load Impedance ≥50 Ω Gain: 0...120 dB controllable in 0.5 dB resolution Advanced Low Noise Design: 93 μV peak to peak input referred to 80 dB gain / 35 MHz bandwidth Frequency Band: 0.35...35 MHz Wide Band / 34 Sub Bands Ultrasound Velocity: 300...20000 m/s (11.81 787.4 "/ms) controllable in 1 m/s (0.1 "/ms) resolution Range: 0.5...3000 μs - controllable in 0.01 μs resolution Display Delay: 0...3200 μs - controllable in 0.01 μs resolution Probe Angle: 0 90° controllable in 1° resolution Probe Delay: 0 to 70 μs controllable in 0.01μs resolution - expandable Display Modes RF, Rectified (Full Wave / Negative or Positive Half Wave), Signal's Spectrum (FFT) Reject: 0...99 % of screen height controllable in 1% resolution DAC / TCG: Theoretical – through keying in dB/mm (dB/") factor Experimental – through sequential recording echo amplitudes from variously located equal reflectors 46 dB Dynamic Range, Slope ≤ 20 dB/μs, Capacity ≤40 points Available for Rectified and RF Display DGS: Standard Library for 18 probes / unlimitedly expandable Gates: 2 Independent Gates / unlimitedly expandable Gate Start and Width: Controllable over whole variety of A-Scan Display Delay and A-Scan Range settings in 0.1 mm /// 0.001" resolution Gate Threshold: 5 95 % of A-Scan height controllable in 1 % resolution Measuring Functions – Digital Display Readout: 27 automatic functions / expandable; Dual Ultrasound Velocity Measurement Mode for Multi-Layer Structures; Curved Surface / Thickness / Skip correction for angle beam probes; Ultrasound velocity and Probe Delay Auto-Calibration for all types of probes Freeze (A-Scans and Spectrum Graphs) Freeze All Freeze Peak All signal and spectrum evaluation functions, managing gates and Gain settings are allowed for frozen signals Encoding: Straight Line Scanning: Time-based (built-in real time clock – 0.02 sec resolution) True-to-location (incremental encoder – 0.5 mm resolution) XY Scanning: Airborne Ultrasound (see below) Airborne Ultrasound Based Encoding Characteristics: Area of probe manipulation ≤2000x3000 mm ≤80x120 " ≤500x500 mm ≤20x20 " ≤200x200 mm ≤8x8 " Curvature radius of scanning surface ≥2000 mm / ≥40 " ≥200 mm / ≥8 " ≥37 mm / ≥1.5 " Scanning Speed ≤150 mm/s ≤6 "/s ≤150 mm/s ≤6 "/s ≤150 mm/s ≤6 "/s Scan Index 1 to 20 mm controllable in 1 mm step 1 to 20 mm controllable in 1 mm step 0.25 mm; 0.5 mm or 1 to 20 mm controllable in 1 mm step Resolution for determining of probe coordinates ≥1 mm / ≥0.04 " ≥1 mm / ≥0.04 " ≥0.25 mm / ≥0.01 " Resolution for determining of probe swiveling angle - 1° 0.5° Range of probe swiveling - ±90° ±90° Immunity to ambient noise ≤60 dB ≤60 dB ≤60 dB Coupling Monitor: Built-in controller and interface for Coupling Monitor suitable for any kind of ultrasonic probe at scanning speed up to 150 mm /sec (6 in /sec); resolution – 0.5 dB Testing Integrity Monitoring: Background imaging of Scanning Plan Recording and imaging of Actual Probe Trace Generating perceptible marks corresponding to current coupling degree, probe position, and swiveling angle whilst scanning Interrupting recording and imaging of actual probe trace if missing coupling and/or probe position and/or swiveling angle Imaging Modes: Thickness Profile B-Scan, Cross-sectional B-Scan, Plane View CB-Scan, C-Scan, D-Scan, P-Scan, TOFD – depending on mode of operation selected accompanied with corresponding instrument settings Imaging Characteristics: Inspection Angle Beam Staright Beam Width of Volume under test 5 to 300 mm controllable in 1 mm resolution – expandable 0.2 to 12 " controllable in 0.01 " resolution - expandable 50 to 2000 mm controllable in 1 mm resolution – expandable 0.2 to 80 " controllable in 0.01 " resolution – expandable Thickness of Volume under test 5 to 300 mm controllable in 1 mm resolution – expandable 0.2 to 12 " controllable in 0.01 " resolution - expandable 0.5 to 300 mm controllable in 0.1 mm resolution – expandable 0.02 to 12 " controllable in 0.01 " resolution - expandable Image Resolution 0.5 mm x 0.5 mm x Half Scan Index 0.02 in x 0.02 in x Half Scan Index 0.2 mm x 0.5 mm x Half Scan Index x 0.01 in x 0.02 in x Half Scan Index Standard Color Scale (Palette) Pseudo Color Gray Thermal Pseudo Color Gray Thermal User Defined Color Scales (Palettes) ≤232 colors ≤232 colors Signal Amplitude Coloring Protocol Linear TCG Normalizing DAC Normalizing DGS Normalizing Customized Linear TCG Normalizing DAC Normalizing Customized Length of one Straight Line Scanning record: 50 20000 mm (2" 800"), automatic scrolling Method of Record: Complete raw data recording Region of Interest: Controllable over entire Display Delay, Probe Delay, Range, US Velocity and other appropriate instrument settings Off-Line Image Analysis: Recovery and play back of A-Scan captured during scanning Echo-dynamic pattern analysis Defects sizing and outlining Statistical analysis of Thickness / Amplitude data Converting Record into ASCII/MS Excel®/MS Word® formats Data Reporting: Direct printout of Calibration Dumps, A-Scans, Spectrum Graphs, Thickness Profile B-Scans, cross-sectional B-Scans, plane view CB-Scans, TOFD maps, CB-Scans, C-Scans, D-Scans, P-Scans, TOFD Maps Data Storage Capacity: At least 100000 sets including calibration dumps accompanied with A-Scans and/or Spectrum Graphs At least 10000 sets including calibration dumps accompanied with Thickness Profile B-Scans, cross-sectional B-Scans, plane view CB-Scans, TOFD maps, CB-Scans, C-Scans, D-Scans, P-Scans, or TOFD Maps and complete sequence of A-Scans captured during scanning Data Logger: Optional – creates and manages database files capable to store up to 254745 records each and organized as 2D matrix; in database every record includes thickness reading accompanied with corresponding raw data A-Scan and instrument setup On-Board Computer AMD LX 800 - 500MHz RAM: 512 Megabytes Flash Memory - Quasi HDD 4 Gigabytes Outputs: LAN, USB X 2, PS 2, SVGA Screen: 6.5" High Color Resolution (32 bit) SVGA 640×480 pixels 133×98 mm (5.24" ×3.86") Sun-readable LCD; Maximal A-Scan Size (working area) – 130×92 mm (5.12" × 3.62") Controls: Front Panel Sealed Keyboard, Front Panel Sealed Mouse, Touch Screen Compatibility with the external devices: PS 2 Keyboard and Mouse, USB Keyboard and Mouse, USB Flash Memory card, Printer through USB or LAN, PC through USB or LAN, SVGA External Monitor Operating System: Windows™ XP Embedded Power: Mains - 100 240 VAC, 40 70 Hz, auto-switch; Battery 12V 8AH up to 6 hours continuous operation Housing: IP 53 rugged aluminum case with carrying handle Dimensions: 265×156×121 mm (10.43"×6.14"×4.76") - without battery 265×156×159 mm (10.43"×6.14"×6.26") - with battery Weight: 3.150 kg (6.93 lbs) - without battery 4.280 kg (9.42 lbs) - with battery Conventional pulse echo and through transmission A-Scan-based inspection 640X480 pixels A-Scan display with physical dimensions 130 x 90 mm (5.12" x 3.62") of working area is largest one for the plurality of portable ultrasonic flaw detectors Combined adjustable spike wave / square wave pulser equipped with variety of probe impedance matching coils provides optimal ultrasound penetration for various materials characterized either by high or low grain, sound attenuation, and the like High frequency probe may not be destroyed occasionally upon connecting to instrument's firing output even if duration of square wave initial pulse is improperly long thanks to probe damage prevention circuit automatically limiting energy transmitted to probe's crystal 46 dB dynamic range 20 dB/΅s maximum slope multiple curve DAC/TCG may be created using up to 40 data points to correct distance – amplitude variations of ultrasonic signals Both theoretical and experimental DAC may be activated either through keying in dB/mm (dB/") factor or through sequential recording echo amplitudes from variously located equal reflectors DAC/TCG may be applied to rectified A-Scans (positive, negative, and full wave) and to RF A-Scans as well Built-in DGS data base for standard probes is unlimitedly expandable Thanks to extended dynamic range signals significantly exceeding A-Scan height (up to 199.9%) may be evaluated without dropping instrument Gain Whilst A-Scan is frozen managing of Gain and Gates settings is still allowed and provides bringing signals to necessary evaluation level and performing required evaluation Dual Ultrasound Velocity Measurement Mode extremely simplifies resolving of sound path distances for dissimilar materials adjacent to each other whereas different values of ultrasound velocity are valid for corresponding signals appearing on the same A-Scan RF display mode combined with frequency domain signal analysis enhances capabilities of the instrument for materials characterization, bond inspection, testing of dissimilar materials, defect pattern analysis, and probes evaluation Optional data logger organizes and manages database files capable to store up to 254745 thickness readings each and organized as 2D matrix. In database every thickness reading is accompanied with corresponding raw data A-Scan and instrument setup. Automatic creating of MS Excel® thickness spreadsheet meets requirements of various Risk Based Inspection and Maintenance (RBIM) procedures And more see technical data page Thickness Profile imaging and recording is performed through continuous capturing of thickness readings along probe trace: Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported Complete sequence of A-Scans is recorded along with thickness profile Off-line evaluation of thickness profile record is featured with: Sizing of thickness damages at any location along stored image: remaining thickness, thickness loss, and length of damage Play-back and evaluation of A-Scans obtained during scanning Off-line reconstruction of thickness profile image for various Gain and/or Gate settings Automatic conversion of thickness profile B-Scan data into MS Excel® thickness spreadsheet meeting requirements of various Risk Based Inspection and Maintenance (RBIM) procedures Typical Application: Corrosion characterization For Thickness Profile imaging movie example click here   On-Line Off-Line B-Scan cross-sectional imaging and recording of defects for longitudinal and shear wave inspection is performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace: Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported Complete sequence of A-Scans is recorded along with B-Scan defects images Off-line evaluation of B-Scan record is featured with: Sizing of defects at any location along stored image – coordinates and projection dimensions Play-back and evaluation of A-Scans obtained during scanning Defects outlining and echo-dynamic pattern Reconstruction of B-Scan defects images for the various Gain and/or Reject settings DAC / DGS B-Scan normalization Typical Applications: Pulse echo inspection of welds, composites, metals, plastics, and the like For B-Scan cross-sectional imaging movie example click here   On-Line Off-Line Line Scanning XY Scanning CB-Scan horizontal plane-view imaging and recording of defects for shear, surface, and guided wave inspection performed through continuous measuring of echo amplitudes and reflectors coordinates along probe trace: Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported Complete sequence of A-Scans is recorded along with CB-Scan defects images Off-line evaluation of CB-Scan record is featured with: Sizing of defects at any location along stored image – coordinates and projection dimensions Play-back and evaluation of A-Scans obtained during scanning Defects outlining and echo-dynamic pattern analysis Reconstruction of CB-Scan defects images for various Gain and/or Reject settings DAC/DGS CB-Scan normalization Typical Applications: Long range pulse echo and CHIME inspection of annular plates and pipes, for pitting, stress corrosion, etc; weld inspection, surface wave inspection For CB-Scan horizontal plane-view imaging movie example click here   On-Line Off-Line CB-Scan imaging of volume under test aside of narrow scanning area is performed through continuous measuring and recording of echo amplitudes, reflectors coordinates, and probe swiveling angle during XY probe manipulating: True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location and swiveling angle Complete sequence of A-Scans is recorded along with real time CB-Scan imaging Off-line evaluation of captured CB-Scan Images and A-Scan distribution data is featured with: Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area Play-back and evaluation of A-Scans obtained during scanning;echo-dynamic pattern analysis CB-Scan image reconstruction for various Gain and/or Reject settings Typical Application: Flaw detection and corrosion screening using guided and surface waves; defect outlining using angle beam probes On-Line Off-Line TOFD Inspection – RF B-Scan and D-Scan Imaging Both time-based (real time clock) and true-to-location (built-in incremental encoder interface and mechanics free airborne ultrasound encoder) mode of data recording are supported Averaging A-Scans whilst recording as per operator's selection Complete sequence of RF A-Scans is recorded along with TOFD map Off-line evaluation of TOFD Map is featured with: Improvement of near to surface resolution through removal of lateral wave and/or back echo record Linearization and straightening Play-back and evaluation of A-Scans obtained during scanning Increasing contrast of TOFD images through varying Gain setting and/or rectification Defects pattern analysis and sizing Zoom of TOFD Map and A-Scans Typical Applications: weld inspection; CHIME inspection For TOFD Inspection movie example click here   On-Line Off-Line Off-Line Corrosion (thickness) mapping is performed through continuous measuring and recording of wall thickness data during XY scanning True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces Complete sequence of A-Scans is recorded along with real time back wall surface rendering Off-line evaluation of captured XY wall thickness and A-Scan distribution data is featured with: Sizing of thickness damages at any location of scanned surface: remaining thickness, thickness loss, XY dimensions, and area of damage Play-back and evaluation of A-Scans obtained during scanning Back wall surface profile reconstruction for various Gain and/or Gate settings Statistical analysis of XY wall thickness distribution data and its conversion into MS Excel® spreadsheet compatible with various Risk Based Inspection and Maintenance (RBIM) procedures Typical Application: Corrosion detection and characterization For movie illustrating principles of corrosion mapping click here For movie illustrating corrosion mapping example click here Straight beam inspection with 3D data presentation (B-, C-, and D-Scan) is performed through continuous measuring and recording of echo amplitudes and reflectors coordinates during XY scanning: True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces Complete sequence of A-Scans is recorded along with real time B-, C-, and D-Scan imaging Off-line evaluation of captured B-, C-, and D-Scan images and A-Scan distribution data is featured with: Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area Play-back and evaluation of A-Scans obtained during scanning; echo-dynamic pattern analysis B-, C-, and D-Scan image reconstruction for various Gain and/or Gate and/or Reject settings Slicing of C-Scan and D-Scan images Statistical analysis of B-, C-, and D-Scan image and its conversion into MS Excel® spreadsheet compatible with various Risk Based Inspection and Maintenance (RBIM) procedures Typical Applications: Weld and base metal angle beam inspection For movie illustrating principles of straight beam inspection with 3D data presentation click here Angle beam inspection with 3D data presentation (P-, D-, and B-Scan) is performed through continuous measuring and recording of echo amplitudes, reflectors coordinates, and probe swiveling angle during XY scanning: True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces Complete sequence of A-Scans is recorded along with real time P-, D-, and B-Scan imaging Off-line evaluation of captured P-, D-, and B-Scan images and A-Scan distribution data is featured with: Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area Play-back and evaluation of A-Scans obtained during scanning; echo-dynamic pattern analysis B-, C-, and D-Scan image reconstruction for various Gain and/or Reject settings Slicing of P-Scan and D-Scan images Typical Application: Weld and base metal angle beam inspection For movie illustrating principles of weld inspection and imaging click here